Bakeng sa theknoloji ea sephutheloana ea HPC chip, TSMC e hlahisitse pampiri ea theknoloji e ncha ea thekeng ea SoIC (SystemonIntegratedChips) ea 3D ho VLSI Technology and Circuits Symposium (2019SymposiaonVLSITechnologies & Circuits) ka Phuptjane 2019; ka boteng ba likompo, ho ntlafatsa lebelo le akaretsang la ts'ebetso lipakeng tsa processor ea CPU / GPU le memori.
Ka kakaretso, ho lebelletsoe ho tsoela pele ho atoloha ka theknoloji ea ho paka ea SoIC, hape e le tharollo e ncha bakeng sa liphutheloana tse tsoetseng pele tsa TSMC ka morao-rao ea InFO (E kopaneng ea Fan-Out) le CoWoS (Chipon Waferon Substrate).
Ho paka ka 3D ho ntlafatsa katleho ea tlhahiso ea HPC ka mekhoa e metle ea ho emisa le mekhahlelo ea bonyenyane
Ka lebaka la ho pharalla ha theknoloji ea nts'etsopele ea semiconductor le ho fokola ha boholo ba karolo, nts'etsopele ea lipakete tsa chip tsa HPC e tlameha ho nahana ka bophahamo bo hlokahalang bakeng sa ho paka le ntlafatso ea ts'ebetso ea chip. Ka hona, ts'ebetso ea nts'etsopele ea bokamoso ba HPC thekenoloji ea pakete ea chip e kenyelletsa mofuta oa fan-out o teng. Ntle le sephutheloana sa boemo bo holimo (FOWLP) le sephutheloana sa 2,5D, nts'etsopele ea mahlale a morao-rao a thata a polokelo ea 3D e tla ba sepheo.
Theknoloji e bitsoang sephutheloana sa 3D e haholo-holo ho ntlafatsa lebelo la komporo le bokgoni ba AI's HPC chip, ho leka ho hokahanya mohopolo oa "high-bandwidth" oa HBM le li-processor tsa CPU / GPU / FPGA / NPU ka theknoloji e phahameng ea TSV (Siliary Perforation). Ka nako e ts'oanang, tse peli li kopantsoe ka kotloloho ho fokotsa tsela ea phetisetso, potlakisa ts'ebetso le lebelo la ts'ebetso, le ho ntlafatsa ts'ebetso ea chip ea HPC ka kakaretso.
TSMC le Intel ba kenya tšebetsong lipakete tsa 3D ka botlalo, e leng se tla lebisa ho pakela le ho etsa liteko tsa OEM ho latela
Ho latela theknoloji ea morao-rao ea ho paka ea 3D, kaha processor le memori ho HPC chip e tlameha ho kenngoa ka nepo, theko ea nts'etsopele e phahame haholo ho feta mahlale a mang a mabeli a sephutheloana (FOWLP, pakete ea 2,5D), mme mathata a ts'ebetso a rarahana haholo. . Tlhahiso e felisitsoeng ea sehlahisoa e tlase.
Hajoale, ho phatlalalitsoe ka katleho ea morao-rao ea theknoloji ea ho paka ea 3D. Boemong bona, ntle le moetapele oa tlhahiso ea OEM semiconductor, TSMC ke eona e sebetsang ka ho fetisisa. E phatlalalitse hore e lebelletsoe ho hlahisa theknoloji ea lipakete tsa 3D tse kang SoIC le WoW (WaferonWafer) ka 2020, le Microsoft OEM Intel. E boetse e fana ka maikutlo a pokello ea 3D ea Foveros, e tla tobana le 'maraka oa ho paka oa li-processor tsa morao-rao le li-chip tsa HPC halofo ea bobeli ea 2019.
Ha baetsi ba lintho tsa ho qala ba semiconductor le limela tsa Microsoft li ntse li tsoela pele ho tsetela ho lisebelisoa tsa R&D bakeng sa mahlale a ho paka tsa 3D, ba tla lebisa leqhubu le leng la polasetiki ea 3D le mahlale a tlhahlobo. Ho lumeloa hore lipakete tsa OEM le lifektheri tsa liteko (joalo ka ASE, Amkor, jj.) Le tsona li tla matlafatsa boiteko ba tsona. Tloaelo ea nts'etsopele ea mahlale ana a polokelo ea maqhubu a 3D.