Molekane oa Apple chip TSMC o tla fihlela kholo le indasteri eohle ea lihlahisoa tsa chip ka 2021. Phuputso ea Counterpoint e re TSMC e lebelletsoe ho tsoelapele ho feta sekhahla sa indasteri, ka sekhahla sa kholo ea 13% ho isa 16%. Bahlahlobi ba li-counterpoint ba ntse ba batlisisa indasteri ea semiconductor mme ba hakanya hore mmaraka oohle o tla fihlela "chelete e phahameng ho feta e lebelletsoeng" ka 2020, mme ba lumela hore boemo bona bo tla tsoelapele ho fihlela 2021.
Phatlalatsong ea eona ea selemo se tlang, k'hamphani e na le ts'epo e kholo ka leano la chip la TSMC le Apple.
Leha lekhetho la indasteri ka 2020 le tla hola ka 23% selemo le selemo ho isa ho US $ 82 billion, Counterpoint e lumela hore e tla hola ho fihlela ho $ 92 billion ho 2021, e leng sekhahla sa kholo ea selemo le selemo sa 12%. Bakeng sa TSMC, kholo ea eona ea thekiso e boletsoeng esale pele ea 13% ho ea 16% ka 2021, haeba e ka fumanoa, e tla feta indastering eohle. Ho isa boholeng bo itseng, sena se tla tsamaisoa ke ho akofisa ha TSMC tlhahiso ea li-node tse lumelletsoeng ke EUV (extreme ultraviolet lithography), tse kenyang li-chips tsa 7nm le 5nm. EUV e nkuoa e le "ntlha ea bohlokoa bakeng sa ho ntšetsa pele Molao oa Moore", e eketsang tšebetso ea transistor ea chip ebe ka tsela eo e ntlafatsa ts'ebetso.
Boemong ba nanometer ea 5, TSMC e tla qala tlhahiso ea bongata kotara ea pele ea 2020, mme Samsung e tla latela bonyane likhoeli tse 6 hamorao. Ho hakanngoa hore thomello ea liphaphatha tse 5-nanometer ka 2021 e tla ikarabella bakeng sa 5% ea liphaphatha tsa lefats'e tse 12-inch, e kaholimo ho tlase ho 1% ka 2020. Apple e nkuoa e le moreki e moholo oa li-chips tsa 5nm ka 2021, mme liodara tsohle li fetisoa ka TSMC, e lebelletsoeng ho ikarabella bakeng sa 53% ea thepa. Sena se bakoa ke ts'ebeliso ea Apple ea mahlale a 5-nanometer ho li-chip tsa A-series tse sebelisitsoeng ho iPhone le Apple Silicon.
Qualcomm e kanna ea ba moreki oa bobeli o moholo ka ho fetisisa oa 5nm wafer, hobane lebaka ke hore Apple le modem ea Qualcomm X60 e ka amoheloang ho "iPhone 13".
Ka 'marakeng oa nanometer ea 7, Apple e lebelletsoe ho ja feela 6% ea liphaphatha tsa eona ho 2021, mohlomong hobane' maraka o busoang ke AMD, Nvidia le Qualcomm o petetsane haholo.
"Hafeela lipelaelo mabapi le pherekano ea phepelo ea thepa li ntse li tsoela pele, baetsi ba chip ba tla boloka maemo a phahameng a pokello ho tloha kotareng ea bone ea 2020." Bahlahlobisisi ba ekelitse hore sena se kanna sa etsa hore "ts'ebetso ea linako tsa selemo e be betere ho feta e tloaelehileng" halofo ea pele ea 2020. Hobane bareki ba foundry ba tla khetha ho beha litaelo tsa wafer pejana.
Tebello ea mmaraka ea lekhetho la TSMC la 2021 le fetang lidolara tse limilione tse likete tse 20 tsa Amerika, rekoto e phahameng, "e utloahala ho ea ka rona," ho boletse Counterpoint. "Ona e tla ba selemo se rekisang sefapano bakeng sa TSMC lipakeng tsa litšiea tse peli tsa kholo ea li-smartphone le HPC."
TSMC e lebelletsoe ho holisa matla a eona a tlhahiso ea 5nm le 3nm nakong ea 2021, ea morao ho nkuoa e sebelisitsoe ke Apple. E le sesupo sa kholo ea nako e tlang, "tšebeliso ea chelete e kholo ho karolelano ea thekiso" e lebelletsoe ho lula ho 40% ea boemo bo holimo ba selemo sena.