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Xilinx
XC7Z035-1FBG676I ImageSheba setšoantšo se seholo
Setšoantšo e kanna ea ba moemeli.
Bona linepe bakeng sa lintlha tsa sehlahisoa.

XC7Z035-1FBG676I

Moetsi Karolo ea Karolo:
XC7Z035-1FBG676I
Moqapi / Brand
Xilinx
Karolo ea Tlhaloso:
IC SOC CORTEX-A9 KINTEX7 676BGA
Datasheets:
XC7Z035-1FBG676I(1).pdfXC7Z035-1FBG676I(2).pdfXC7Z035-1FBG676I(3).pdf
Temo ea mahala ea boemo bo phahameng / boemo ba RoHS:
Lead mahala / RoHS Compliant
Boemo ba setoko:
Ncha ea mantlha, li-pcs tsa 2000 tse ncha lia fumaneha.
Mohlala oa Ecad:
Tsamaisa Ho Tloha:
Hong Kong
Tsela ea thomello:
DHL/Fedex/TNT/UPS

Tlhahlobo Inthaneteng

Ka kopo tlatsa likarolo tsohle tse hlokahalang ka tlhaiso-leseling ea hau ea puisano.Chofoza "TLHOKOMELANG TLALI"Re tla ikopanya le wena haufinyane ka lengolo-tsoibila. Kapa re romelle lengolo-tsoibila: Info@IC-Comonents.com
Karolo ea Karolo
Moetsi
Hloka Boholo
Theko ea theko(USD)
Lebitso la K'hamphani
Lebitso la ho ikopanya
E-mail
Nomoro
Molaetsa
Ka kopo kenya Code ea netefatso ebe o tobetsa "Kenya"
Karolo ea Karolo XC7Z035-1FBG676I
Moqapi / Brand Xilinx
Boholo ba thepa 2000 pcs Stock
Sehlopha Litokisetso tse kopanetsoeng (IC) > E kenyelitsoe - System On Chip (SoC)
Tlhaloso IC SOC CORTEX-A9 KINTEX7 676BGA
Temo ea mahala ea boemo bo phahameng / boemo ba RoHS: Lead mahala / RoHS Compliant
Lirapa tsa RFQ XC7Z035-1FBG676I Lintlha tsa XC7Z035-1FBG676I tsa PDF tsa en .pdf
Package ea Lisebelisoa tsa Thepa 676-FCBGA (27x27)
Lebelo 667MHz
Sehlooho Zynq®-7000
RAM Size 256KB
Litšobotsi tsa Mantlha Kintex™-7 FPGA, 275K Logic Cells
Li-périipherals DMA
Packaging Tray
Package / Case 676-BBGA, FCBGA
Mocheso o sebetsang -40°C ~ 100°C (TJ)
Palo ea I / O 130
Mokhoa oa ho Utloisisa Bohloko (MSL) 3 (168 Hours)
Boima ba Flash -
Tlhaloso e qaqileng Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 275K Logic Cells 256KB 667MHz 676-FCBGA (27x27)
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Ho buisana CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Litlhōlisano MCU, FPGA

Ho paka

Re fana ka boleng bo holimo ka ho fetisisa, ba pakiloeng ka theko e phahameng ka ho fetisisa ea moruo e fumanehang. Ka ponaletso ea leseli ea 40%, e iponahatsa e le pontšo ea li-IC's (li-circuits tse kopaneng) le li-PCB (li-boardcircuit board). Ts'ireletso ea tšepe e tšoarellang ho fetisisa e patiloeng e fa FaradayCage ts'ebetso e hlokahalang ho sirelletsa likonteraka tsena khahlano le li-tuli.




Lihlahisoa tsohle li tla paka ka anti-staticbag. Tsamaea ka ts'ireletso ea antistatic ea ESD.
Ntle le tse fumanehang ka har'a lipakatso tsa ESD li tla sebelisa leseli la rona: Karolo ea Motsoako, Brand le Boholo.
Re tla hlahloba thepa eohle pele re tsamaisoa, re netefatsa hore lihlahisoa tsohle li maemong a matle mme re netefatse hore likarolo ke litheolelo tse ncha tsaalmalmatch.
Kamora hore thepa eohle e netefatse hore ha e na mathata kamora ho paka, re tla e paka ka mokhoa o sireletsehileng ebe re e romella ka polelo ea lefats'e. E bontša ho phunya le ho hanyetsa likhapha hammoho le botšepehi bo tiileng ba tiiso.
Re ka fana ka ts'ebeletso ea ho fana ka litšebeletso lefatšeng ka bophara, joalo ka DHLor FedEx kapa TNT kapa UPS kapa e mong ea fetisang thepa pele.

Tsamaiso ea Lefatše ka bophara ke DHL / FedEx / TNT / UPS

Litefiso tsa Shipping DHL / FedEx
1). O ka fana ka akhaonto ea hau ea tlhahiso ea thepa bakeng sa ho romelloa, haeba u se na ak'haonte efe kapa efe ea ho romella thepa, re ka fana ka tlaleho ea inadvance ea rona.
2). Sebelisa akhaonto ea rona bakeng sa ho tsamaisa thepa, tefo ea thomello (Reference DHL / FedEx, linaha tse fapaneng li na le theko e fapaneng.)
Litefiso tsa thomello :: (Reference DHL le FedEX)
Boima (KG): 0.00kg-1.00kg Theko (USD $): USD $ 60.00
Boima (KG): 1.00kg-2.00kg Theko (USD $): USD $ 80.00
* Theko ea litšenyehelo e bontšoa ho DHL / FedEx. Lintlha tse qotsitsoeng, ka kopo ikopanye le rona. Naha e fapaneng liqoso tse hlahisitsoeng ka mokhoa o fapaneng li fapane.



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